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CIN::APSE ?
High-Speed Interconnect Technology
■ High signal speed capability enabling frequencies greater than 20 GHz.
■ Z-Axis, solderless, compression mount interconnect system.
■ Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to
PCB, and parallel PCB to PCB interconnections.
■ Provides solutions to many of the problems associated with through hole and surface mount
soldered technology.
■ Enables upgrade and system maintenance strategies.
■ Available in custom I/O configurations and I/O counts from 1 to over 5,000.
■ Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
■ Contact centerline spacing of 1mm or greater.
■ Excellent reliability in commercial, military, and aerospace applications.
■ Application can result in lower installed and system maintenance costs.
Contact Material: Molybdenum
CIN::APSE Contact Plating: Gold
Plunger Material: Copper alloy
Plunger Plating: Gold
Insulator Material: Liquid crystal polymer
Packaging Tray Material: Anti-static ABS
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Temperature Life Testing: 1000 Hours @ 200°C
Thermal Shock: 2,000 Cycles @ 20°C to 110°C
Humidity: 5,000 Hours @ 30°C to 80°C, 80% RH
Salt Spray: 96 Hours
Low Temperature: Operates in liquid nitrogen (77°K)
Bellcore TR-NWT-001217: Passed with plungers
Button-Only Configuration with 0.020" (0.5 mm) Diameter
IC Component to Board Socket (LGA)
DC Resistance:
Inductance:
Current-Carrying Capability:
Insulation Resistance:
Dielectric Withstanding Voltage:
15m ? average
Less than 1 nH
Up to 3 Amps.
25,000 Meg ? @ 500 VDC
900 VAC at sea level
Button-Only Configuration with 0.020" (0.5 mm) diameter
Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
Shock: 100 Gs; 6 milliseconds, no discontinuity
greater than 2 nanoseconds
Vibration: 20 Gs; 10-20,000 Hz; no discontinuity
greater than 2 nanoseconds
Flex Circuit to PCB
Call Toll Free: 1 (800) 323-9612
1-1
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